Samsung plans to bring advanced heat management to not just the Ultra, but also the base Galaxy S26—with a copper-based Heat Pass Block solution.
Samsung Expands Cooling Innovation Beyond Ultra Model
Samsung is reportedly bringing advanced cooling technology to the base Galaxy S26 model, marking a major shift in how the company handles thermal performance across its flagship lineup.
- Traditionally, only the Ultra variant received high-end cooling systems like vapor chambers.
- Now, even the entry-level Galaxy S26 may feature a Heat Pass Block (HPB)—a copper-based heat sink solution.
- This move is tied to Samsung’s plan to reintroduce Exynos chips into the S-series, specifically the Exynos 2600.
What Is HPB and Why Does It Matter?
The Heat Pass Block (HPB) is Samsung’s next-gen cooling approach designed to:
- Dissipate heat from the application processor (AP) faster
- Prevent thermal throttling during high performance
- Enhance long-term stability and battery efficiency
How it works:
- A copper heat sink is layered over the Exynos 2600 chip and DRAM in a package-on-package (PoP) layout.
- This setup soaks up and spreads heat, reducing CPU strain.
Compared to previous solutions used in the Exynos 2500, which only stacked DRAM over the chip, HPB adds an additional layer of thermal protection.
Exynos 2600 and the Return of Samsung’s In-House Silicon
The Exynos 2600 is being manufactured using Samsung’s 2nm process, promising:
- Greater power efficiency
- Enhanced AI and GPU performance
- Potential performance parity with Qualcomm’s latest chips
Samsung is currently evaluating the new thermal system and chip quality. If results are promising, Exynos 2600 could power the base Galaxy S26, marking a return to the dual-chip strategy—where Exynos models are sold in select markets.
The Bigger Picture: Cooling is Key to Exynos Comeback
Heat management has long been a weak spot for Exynos chips, contributing to their removal from past S-series flagships.
- The S25 series went all-in on Snapdragon, following user criticism of Exynos performance and overheating.
- With the HPB solution, Samsung aims to fix the heat issues and restore user confidence in Exynos-based devices.
If successful, the move could stabilize performance, reduce thermal issues, and pave the way for future Samsung-designed chips in global markets.
Timeline and What’s Next
- Samsung will complete testing of the HPB + Exynos 2600 system by Q4 2025.
- If performance targets are met, the new chip and cooling tech will go into mass production for the Galaxy S26 series.
- Otherwise, Samsung may stick with Snapdragon-only variants or limit Exynos to select regions.
