A next-gen Snapdragon 8 Elite Gen 5 variant, built on Samsung’s 2nm process, could replace Exynos in the upcoming foldables
Qualcomm’s Latest Snapdragon Chip Fuels Speculation
Qualcomm recently introduced its most powerful mobile chipset yet—the Snapdragon 8 Elite Gen 5. While the standard version is confirmed to be built on TSMC’s 3nm process, Samsung may have more ambitious plans involving an in-house manufactured variant.
Samsung has historically received a “for Galaxy” overclocked version of Qualcomm’s chips for its flagship phones, like the Galaxy S and foldable series. However, according to Korean media, Samsung may now go a step further by manufacturing its own version of the Elite Gen 5 on its 2nm GAA (Gate-All-Around) process.
Galaxy Z Flip 8 May Ditch Exynos Completely
Unlike some of Samsung’s other smartphones that use a mix of Exynos and Snapdragon chips depending on region, the Galaxy Z Flip 7 used an Exynos processor in certain markets.
However, all signs point to the Galaxy Z Flip 8 moving entirely to Snapdragon—potentially to a customized, Samsung-made Snapdragon 8 Elite Gen 5:
- Samsung has reportedly supplied test samples of this custom chip to Qualcomm
- If Qualcomm is satisfied with performance and yields, it may approve the chip for commercial use in the Z Flip 8
- This would mark a significant milestone for Samsung’s 2nm manufacturing capabilities
The Bigger Picture: Samsung’s 2nm Ambitions
Samsung is working hard to improve yield and reliability of its 2nm GAA process, which is also the foundation for the upcoming Exynos 2600 chipset.
- The Exynos 2600 is expected to appear in some Galaxy S26 series models
- If yield targets are met, Samsung could win manufacturing contracts from Qualcomm for future chip production
- This shift could increase Samsung Foundry’s competitiveness against TSMC in the premium mobile SoC space
Could the Galaxy Z Fold 8 Use the Same Chip?
If the Galaxy Z Flip 8 adopts this custom Snapdragon chip, it’s logical to assume that the Galaxy Z Fold 8 may also follow suit:
- Both devices are part of Samsung’s next-gen foldable lineup
- A unified chipset approach would simplify development and optimization
- It would also create performance parity between the Flip and Fold models
More definitive details are expected in the coming months as both Qualcomm’s evaluations and Samsung’s production roadmap take shape.
