With Pixel 11 testing a MediaTek modem and TSMC already handling Tensor chip production, Google’s split from Samsung may deepen in 2025.
Google Pixel 11: A Strategic Shift in the Making
Google is preparing to launch its Pixel 11 series next year, and early tests suggest another big hardware shake-up—one that could further distance the company from Samsung.
- The Tensor G6 chipset, expected to power Pixel 11, is already being produced by TSMC, not Samsung Foundry.
- Now, internal tests hint that Google may also drop Samsung’s Exynos modem in favor of MediaTek’s M90 modem.
If confirmed, this would mark Google’s second major departure from Samsung hardware in just two product cycles.
What’s Behind the Switch to MediaTek?
Samsung’s Exynos 5400(i) modem was used in the Pixel 9 and Pixel 10 series. It effectively resolved overheating and connectivity issues, yet it appears Google is still exploring alternatives.
- Google originally planned the switch to MediaTek for the Pixel 10, but ultimately stayed with Exynos.
- For Pixel 11, Google is now testing the MediaTek M90 5G modem, which was introduced at MWC 2025.
Key MediaTek M90 Specs:
- 12Gbps peak downlink speeds
- Dual 5G SIM dual-active support
- Integrated AI features for power and performance efficiency
These enhancements suggest Google is prioritizing battery life, thermal management, and AI performance tuning—areas where MediaTek could outshine Samsung’s Exynos modem.
Why Samsung Should Still Be Concerned
Samsung may not be losing a huge volume client, but the symbolism of Google’s shift matters.
- Google’s Tensor chip journey began with Samsung, and the companies worked closely on custom Exynos-based silicon.
- With the Tensor G6 now reportedly manufactured on TSMC’s advanced 2nm node, Samsung’s Foundry is completely out of the Pixel chipset picture.
Combined with a potential modem replacement, Samsung’s hardware role in Pixel phones may soon drop to zero.
The Bigger Picture: Google vs Samsung
Although Pixel sales remain modest, Google’s moves are strategic and possibly indicative of industry direction:
| Component | Pixel 9/10 | Pixel 11 (Rumored) |
|---|---|---|
| Chipset | Tensor G4 (Samsung Foundry) | Tensor G6 (TSMC, 2nm) |
| Modem | Samsung Exynos 5400i | MediaTek M90 |
| Bootloader Code | “deepspace” | “spacecraft” |
These subtle shifts show how Google is diversifying its supply chain—and that could set a precedent for other OEMs.
Samsung’s Response: Improvements on the Horizon
Samsung isn’t standing still. The company is reportedly making major improvements in both its Foundry process and Exynos chipset lineup:
- Exynos 2600, expected in the Galaxy S26 series, is built on a more refined and power-efficient architecture.
- Samsung Foundry is aiming to close the performance gap with TSMC through process improvements and yield gains.
The challenge for Samsung now is to rebuild confidence and retain major clients in an increasingly competitive chipset market.
What’s Next for Pixel 11?
So far, here’s what’s shaping up for the Pixel 11:
- Tensor G6 codenamed Malibu
- Built on TSMC 2nm node for performance and battery gains
- Testing MediaTek M90 modem with dual 5G SIM and AI power controls
- New bootloader code: spacecraft, hinting at an evolved platform architecture
If these tests translate into final hardware, Pixel 11 could become Google’s most efficient and thermally balanced phone to date—without any Samsung silicon inside.
