Samsung to Deliver Glass Substrate Samples to US Tech Firms in 2025
Prototype production kicks off in Korea as Samsung positions glass substrates for future AI and chip packaging
Glass substrates nearing real-world application
Samsung Electro-Mechanics has confirmed that it will supply glass substrate (interposer) samples to major US tech companies before the end of 2025, marking a critical milestone in the company’s semiconductor roadmap.
- According to CEO Jang Deok-hyun, Samsung is nearing completion of its prototype production line at the Sejong plant in Korea, expected to go operational by Q2 2025.
- Initial samples will be sent to two or three top-tier US firms, hinting at interest from major players in AI and data-centric sectors.
This step underlines Samsung’s commitment to next-generation semiconductor packaging, a key component in the evolution of AI and high-performance computing.
Why glass substrates matter
Unlike traditional plastic substrates, glass substrates offer critical advantages:
- Higher heat resistance, ideal for the thermal demands of modern processors.
- Smoother surfaces, which allow for more precise microcircuit integration.
- Enhanced potential for data processing speed, especially valuable for AI workloads and advanced logic chips.
The transition to glass substrate is seen as a game-changer in semiconductor design, particularly as chip packaging becomes more complex with multi-die systems and 3D stacking.
Industry challenges remain
Despite the promise, commercialization is still in its early stages. Samsung and its partners are working to overcome several technical barriers:
- Drilling micro-holes in glass and filling them with copper is a precise but difficult process.
- Cutting and shaping glass at industrial scale without damaging its integrity is another obstacle.
- Reliability and mass yield also remain focus areas before commercial viability.
To tackle these issues, Samsung Electro-Mechanics recently held a glass substrate seminar, inviting industry players to collaborate on technology standardization and process optimization.
Building a new ecosystem
Samsung is pushing for the creation of a collaborative supply ecosystem around glass substrate manufacturing.
- It aims to engage small and medium-sized enterprises (SMEs) to accelerate innovation and close the development gap.
- The company views this as a long-term strategy to ensure faster adoption and scalable production across the industry.
Samsung is already working closely with Samsung Electronics, which plans to integrate glass substrates into advanced semiconductor packaging starting in 2028.
Roadmap: From samples to mass production
Here’s Samsung’s projected timeline for glass substrate development:
- 2025: Sample distribution to US tech partners.
- 2027: Target for mass production to begin at commercial scale.
- 2028: Adoption by Samsung Electronics for AI and HPC chip packaging.
With the industry’s growing need for faster, cooler, and more compact chips, Samsung’s move into glass substrates could redefine the backbone of AI infrastructure and next-gen computing systems.
